Thick paste of nano-sized silver powder in an organic binder formulation.
N-series: for bonding chips less than 3 mm x 3 mm without pressure at bondline thickness of 10 μm to 15 μm.
K-series: for bonding large chips with modest pressure of less than 5 MPa or 730 psi at bondline thickness from 10 μm to 75 μm.
The innovation of NBE’s nanoTach® technology comes from proprietary formulation and procedures for making uniform pastes of nanoscale silver powders. In recent years, a low-temperature joining technique (LTJT) based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing.
NBE’s nanoTach® pastes are targeted at joining semiconductor chips for high-performance, high-reliability, and high junction-temperature applications, such as power electronics, automotive electronics, concentrated photovoltaics, high-power light-emitting diodes (LEDs) or high-power laser diodes, and high-power, compact communication systems.