Material (nanoTach®) solution for thermal management and high-temperature applications
Materials
nonaTach (nano-silver paste) Devices/Modules Applications

 

Main Features

  • RoHS compliant replacements for die-attach and thermal interface;
  • 5x higher thermal and electrical properties;
  • > 250˚ C capability;
  • < 275˚ C ambient or low pressure (5 MPa) processing;
  • Improved reliability from low elastic modulus.