Pastes of silver powder in organic solvent/binder for bonding chips without pressure and at temperature less than 260oC.
Pre-forms of silver powder in organic binder for bonding chips at low pressure and < 260oC.
The innovation of NBE’s nanoTach® technology comes from proprietary formulation and procedures for making uniform pastes of nanoscale silver powders. In recent years, a low-temperature joining technique (LTJT) based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing.
NBE’s nanoTach® pastes are targeted at joining semiconductor chips for high-performance, high-reliability, and high junction-temperature applications, such as power electronics, automotive electronics, concentrated photovoltaics, high-power light-emitting diodes (LEDs) or high-power laser diodes, and high-power, compact communication systems.