Our Technology

Electronic Modules

Today all semiconductor devices in the state-of-the-art individual packages or multi-chip power modules are attached to substrates using pastes of lead or lead-free solder alloys or an electrically conductive epoxy. These die-attachments have low electrical and thermal conductivity, and the soldered attachment is also susceptible to fatigue failure under cyclic loading. NBE’s lead-free nanomaterial attachment possesses better thermal, mechanical and electrical properties than soldered or epoxied attachment. The attachment process is also completely compatible with existing equipment and facilities that use solders or epoxies. Using NBE’s material and process, high power-density semiconductor electronic or optoelectronic devices can be operated at high temperatures in excess of 250˚ C, not attainable with any existing solder-based or epoxy-based materials.

Compared to the current die-attach materials, NBE’s solution offers:

  • 5x higher thermal and electrical properties;
  • > 250˚ C capability;
  • < 275˚ C ambient or low pressure (5 MPa) processing;
  • Improved reliability from low elastic modulus.
  • One-to-one RoHS compliant replacements.

One prominent distinguishing characteristic removes customer acquisition concerns:

NBE’s materials are one-to-one replacements for solders or epoxies so that customers do not need to retool their manufacturing processes.

Properties of NBE’s nanoTach® Material
  NBE’s nanoTach® High-lead solder (95Pb-5Sn) Eutectic Gold-tin solder Hysol® QMI 3555R
Processing temperature
< 280˚C
340˚C
320 – 340˚C
300 – 450˚C
Maximum use temperature
<961˚ C
(mp of Ag)
<280˚C
< 280˚C
< 250˚ C
Bonding shear (MPa
20 – 40
15
> 100
20
Elastic modulus (GPa)
9
19
80
11.5
Electrical conductivity, 10 5 ( Ω ·cm) -1
3.8
0.45
0.625
6.7x10 -7
Thermal conductivity (W/K·m)
240*
23
58
80
RoHS Compliancy Status
Compliant
Not Compliant
Compliant
Compliant

*Estimated based on electrical resistivity measurement.

Additional Information