NanoTach® (nanosilver paste): N and K Series
Product Description
Thick paste of nano-sized silver powder in an organic binder formulation.
N-series: for bonding chips less than 3 mm x 3 mm without pressure at bondline thickness of 10 μm to 15 μm.
K-series: for bonding large chips with modest pressure of less than 5 MPa or 730 psi at bondline thickness from 10 μm to 75 μm.
Key Features
- Uniform dispersion for screen/stencil printing or dispensing
- Low sintering temperature
- Excellent sintered properties
- RoHS compliant
Applications
Bonding small to large chips for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
Typical Properties
| Physical Data Before Sintering: | Physical Data After Sintering | ||
|---|---|---|---|
| Color: | dark gray | Porosity: | < 30% |
| Solid loading: | 71 - 78.5% | Density: | > 7.9 g/cm3 |
| Density: | > 3.0 g/cm3 | CTE (coefficient of thermal expansion): | 19.6 x10-6 /oC |
| Viscosity: | Viscosity: 150,000 to |
Melting temperature: | 961oC |
| Sintering temperature: | < 275oC | Elastic modulus: | ~ 10 to 30 GPa |
| Shelf life1: | ~ 12 mo. | Electrical resistivity: | < 2.6x10-6 Ω•cm |
| Thermal conductivity2: | > 2.0 watt/cm•oC | ||
| Chip bonding strength: | > 25 MPa | ||
| 1 If stored in sealed containers at room temperature | 2 Calculated from electrical measurement |