The innovation of NBE's nanoTach® technology comes from proprietary formulations and procedures for making uniform pastes or dry films of silver powders.  In recent years, die-attach based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing.


NBE's nanoTach® pastes or dry films are targeted at joining semiconductor chips for high-performance, high-reliability, and high junction-temperature applications, such as power electronics, automotive electronics, concentrated photovoltaics, high-power laser diodes, and high-power, compact communication systems.