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NanoTach Paste:
***Silver Sintering Die-attach at Zero Pressure***
***Silver Sintering Die-attach at Zero Pressure***
PRODUCT DESCRIPTION
Thick paste of silver powder in an organic binder formulation
KEY FEATURES
Uniform dispersion for screen/stencil printing or dispensing
Low sintering temperature (200oC – 250oC)
Ideal sintered bond-line thickness: 25 to 50 microns
Excellent sintered properties
RoHS compliant
Applications
Pressure-free bonding of small to large chips (over 10 mm x 10 mm) for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
NanoTach Preform or Dry Film:
*** Silver Sintering Dry Film for Low-Pressure-Assisted Die-Attach ***
PRODUCT DESCRIPTION
Dry silver-powder film on a polyester carrier tape for die-attaching semiconductor devices.
KEY FEATURES
Uniform dry film for long storage time
Ease of transferring onto device or substrate (< 120oC, < 3 MPa, < 3 sec)
Low-temperature, low-pressure sintering (< 260oC and < 10 MPa)
Excellent sintered properties
RoHS compliant
APPLICATIONS
High thermal/electrical conductivity, high-temperature, and high reliability bonding of small to large chips for power devices/modules, high-power and high-brightness LED lamps, power diode lasers, RF power devices.
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