Our Technology
The innovation of NBE’s nanoTach® technology comes from proprietary formulation and procedures for making uniform pastes of nanoscale silver powders. In recent years, a low-temperature joining technique (LTJT) based on silver sintering has emerged as a promising lead-free die-attach solution to replace soldering or epoxy curing. However, the LTJT process with existing micron-scale silver pastes requires a force in excess of 300 Kg on a 1 cm x 1 cm chip to lower the silver sintering temperature. Using NBE’s nanoTach® pastes that can be sintered at low temperature without pressure, the LTJT process is significantly simplified. The nanoTach® technology was recognized with a 2007 R&D 100 Award — a mark of excellence known to industry, government, and academia as proof that the product is one of the most innovative ideas of the year.
| NBE’s nanoTach® | High-lead solder (95Pb-5Sn) | Eutectic Gold-tin solder | Hysol® QMI 3555R | |
|---|---|---|---|---|
| Processing temperature | < 280oC |
340oC |
320 – 340oC |
300 – 450oC |
| Maximum use temperature | <961oC (mp of Ag) |
<280oC |
< 280oC |
< 250oC |
| Bonding shear (MPa | 20 – 40 |
15 |
> 100 |
20 |
| Elastic modulus (GPa) | 9 |
19 |
80 |
11.5 |
| Electrical conductivity, 105 (Ω•cm) -1 | 3.8 |
0.45 |
0.625 |
6.7x10 -7 |
| Thermal conductivity (W/K•m) | 240* |
23 |
58 |
80 |
| RoHS Compliancy Status | Compliant |
Not Compliant |
Compliant |
Compliant |
*Estimated based on electrical resistivity measurement.